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Potting Compounds for Power Electronics
Štajner, David ; Červinka, Dalibor (referee) ; Vašíček, Adam (advisor)
Potting compounds are often used in electrotechnics to protect the electronics from the adverse effects, improves its insulating properties and helps to improve the heat transfer from the embedded devices in the surroundings. Embedding electronics into encapsulants extend the field of application. Such electronics can then be used in wet, dusty, corrosive or otherwise harsh environments.
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Fabrication of micro- and nanostructures by different etching methods
Těšík, Jan ; Urbánek, Michal (referee) ; Šamořil, Tomáš (advisor)
The selective etching is currently very widely used method for the preparation of micro- and nanostructures. This thesis deals with the principles of the etching methods, their applications and also the possibilities of dry and wet etching at the Institute of Physical Engineering. The experimental part is devoted to the preparation of the etching masks to ensure etching selectivity and to the preparation of pre-defined micro- and nanostructures. Important parameters were determined from the results, e.g. Si etch rate, selectivity of the masks etc. Further, the suitability of the used methods and etching masks were compared.
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Design of technology for the production of silicone part
Dubovský, Jakub ; Ohnišťová, Petra (referee) ; Žák, Ladislav (advisor)
The focus of this paper deals very closely with the injection moulding technology. In the first part, a literature review dealing with elastomer and silicone materials is presented. This section is followed by the research of construction aspects and application of injection machines for the above-mentioned materials. General section is concluded with an analysis of injection moulding cycle and variable production methods and tools. In the second part, the proposal for production for silicone part and design of the tool is explained. It includes by examining the production conditions based on affiliated requirements, particularly the construction specifics of the designed tool. For this purpose, a technical drawing of the assembly is also made.
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Construction of foundry core boxes and their use for the production of silicone parts
Skalický, Jan ; Kaněra, Miloš (referee) ; Jelínek, Radim (advisor)
The thesis deals with the design of a mold for use in casting of plastics and rubbers. The product is two different gaskets used in the testing of tubes for automotive industry. The part has a cylindrical shape with a diameter of 19 mm and a length of 25 mm, where two holes with a diameter of 4 mm are additionally drilled in one of them. Depending on the service life, the batch size is approximately 200 pieces per year. The material was not specified, so after research two options were chosen. The first was RTV-2 condensation silicone rubber LUKOPREN N 1522 from Lučební závody a.s. Kolín and the second one was RTV-2 additive silicone rubber ELASTOSIL M 4642 A/B from Wacker-Chemie, s.r.o. The second material came out better from preliminary testing. By gradually improving the design of a simple single-piece steel mold, a final version was created which is double in size and consists of three parts. It is made by 3D printing using FDM method from PLA material. It was found that in order to achieve a defect-free casting, the mix must be vacuumed before casting.
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Universal module for supporting team games
Zemanová, Renata ; Junasová, Veronika (referee) ; Šteffan, Pavel (advisor)
The goal of this diploma thesis is to design electronic device called Universal module, which serves as an assistant for outdoor games. The design focuses on safety, simplicity and low cost. Due to the outdoor use, water resistance is also addressed. This thesis deals with selection and design of the electronics. Emphasis is given on the selection of light signaling, of the wireless module, power supply and microcontroller. The PCB design was carried out on 2 connected boards. Firmware was created for simplified programming of the Universal module and demonstration modes were also created for different activities.
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Design of technology for the production of silicone part
Dubovský, Jakub ; Ohnišťová, Petra (referee) ; Žák, Ladislav (advisor)
The focus of this paper deals very closely with the injection moulding technology. In the first part, a literature review dealing with elastomer and silicone materials is presented. This section is followed by the research of construction aspects and application of injection machines for the above-mentioned materials. General section is concluded with an analysis of injection moulding cycle and variable production methods and tools. In the second part, the proposal for production for silicone part and design of the tool is explained. It includes by examining the production conditions based on affiliated requirements, particularly the construction specifics of the designed tool. For this purpose, a technical drawing of the assembly is also made.
|
|
|
Potting Compounds for Power Electronics
Štajner, David ; Červinka, Dalibor (referee) ; Vašíček, Adam (advisor)
Potting compounds are often used in electrotechnics to protect the electronics from the adverse effects, improves its insulating properties and helps to improve the heat transfer from the embedded devices in the surroundings. Embedding electronics into encapsulants extend the field of application. Such electronics can then be used in wet, dusty, corrosive or otherwise harsh environments.
|
|
|
Fabrication of micro- and nanostructures by different etching methods
Těšík, Jan ; Urbánek, Michal (referee) ; Šamořil, Tomáš (advisor)
The selective etching is currently very widely used method for the preparation of micro- and nanostructures. This thesis deals with the principles of the etching methods, their applications and also the possibilities of dry and wet etching at the Institute of Physical Engineering. The experimental part is devoted to the preparation of the etching masks to ensure etching selectivity and to the preparation of pre-defined micro- and nanostructures. Important parameters were determined from the results, e.g. Si etch rate, selectivity of the masks etc. Further, the suitability of the used methods and etching masks were compared.
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